RapiTrim Wafer Trimming
IR laser trimming and wafer probe system with simplified integration of modern automated testing equipment (ATE) and industry standard wafer loader/unloader options.
ProVia Hybrid Microvia Drilling
The combination of both UV and CO2 lasers, commonly known as the hybrid process, provides the greatest opportunity for process optimization in the widest range of materials.
RapiTrim Chip Resistor Trimming
Systems are designed to work with extremely complex and demanding chip resistor applications requiring advances found in next generation resistor trimming systems.
Wireless Probe Card Design
Wireless probe cards for RapiTrim resistor trimming systems reduce the time and difficulty of swapping probe cards during job changes.
ProSys System Control Software
An intuitive graphical interface that offers unmatched ease of use for both operators and process engineers.
RapiTrim Circuit and Component Trimming
Turnkey laser resistor trimming systems for thick and thin film hybrid circuits and electronics components with the ability to handle both high-mix and high volume production.
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