Systems

ProVia FP-UC

Drilling and Cutting System

ProVia laser via drilling system
ProVia laser via drilling system

UV + CO2 Dual Laser system, providing the broadest capability with optimum speed

ProVia FP-UC laser drilling and cutting systems incorporate both UV and CO lasers and scan heads. The CO laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics.

laser via driller autoloader

System Features Include:

  • Intuitive Graphical User Interface with ProSys operating software.
  • Advanced Beam Positioning and Laser Pulse Control provide high throughput, accuracy, and process stability.
  • Auto-Calibration functions ensure repeatable quality.
  • Extensive System Diagnostics continuously monitor all critical components and machine performance.
  • Sealed Beam Delivery protects optics from process debris, extending component lifetimes
  • Active Pulse Shaping to provide precise control on a pulse-by-pulse basis.
  • Touchscreen operation (full HD size).
  • Automatic Run-time Calibration means no operator intervention is required for an entire batch.

ProVia - Making your production more productive